Foxconn-HCL Partnership To Establish Semiconductor Assembly, Packaging Unit In India - 05:02 min - News - Video
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Published Date: 2024-01-18 07:53:14, Category: News (572265)
Time: 05:02 min, View Count= 35 ( + More Social Media views ) , Rating=
Title: Foxconn-HCL Partnership To Establish Semiconductor Assembly, Packaging Unit In India

Keywords:
Foxconn-HCL Partnership Establish Semiconductor Assembly, Packaging Unit India

Description:
Foxconn and HCL Group have announced a semiconductor Joint Venture (JV) in Taiwanese firm Foxconn will invest million for a % stake in the Foxconn had announced setting up

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